A Fanless Laptop Just Arrived, and It Uses Plasma to Stay Cool

A New Jersey based technology company has finalized the first consumer laptop design cooled entirely without mechanical fans. YPlasma confirmed the world’s first noiseless laptop ahead of its public debut at CES 2026, according to company disclosures and industry briefings.

The decision clears the commercial introduction of dielectric barrier discharge plasma actuators as a replacement for traditional laptop cooling systems at a moment when AI driven computing loads are pushing thermal limits across the industry.

Officials familiar with the development said the system represents the first time plasma based cooling has been miniaturized, safety certified, and integrated into a consumer electronics form factor suitable for mass production.

YPlasma says on their news section:

As electronics become thinner and AI-driven processing demands more power, traditional cooling methods are reaching their physical limits. YPlasma’s solid-state technology addresses these challenges by using cold plasma to generate high-velocity “ionic wind” without a single moving part.

The approval at Las Vega CES 2026 enables YPlasma to demonstrate a fully operational laptop cooled exclusively by dielectric barrier discharge plasma actuators. The system removes mechanical fans, heat pipes, and moving airflow components entirely, replacing them with solid state thin film actuators that generate controlled ionic airflow using cold plasma.

“Unveiling the first laptop cooled with our DBD plasma actuators marks a historic moment — not just for YPlasma, but for the entire electronics industry,” said David García Pérez, CEO and Co-Founder of YPlasma. “We’re excited to engage with global partners and demonstrate what our technology can achieve.”

“The AI era requires a complete rethink of how we manage heat and air,” García Pérez continued. “With our engineering teams in Madrid and Newark, we are bringing space-grade technology—packaged in a 200-micron film—to everything from your laptop to the next generation of aircraft.”

YPlasma’s system uses dielectric barrier discharge to ionize air across a protected electrode surface, generating high velocity airflow without combustion or heat generation. The actuators measure roughly 200 microns thick and integrate directly into heat sinks, chassis walls, or component surfaces. The same actuator can deliver both cooling and heating, enabling dynamic thermal control within a single device.

Laptop thermal systems have become a binding constraint on performance as processors designed for AI inference, on device machine learning, and high density workloads generate sustained heat. Industry roadmaps from Intel, AMD, and NVIDIA have repeatedly warned that mechanical cooling is nearing its efficiency ceiling. Plasma based airflow allows heat to be moved without noise, vibration, or mechanical wear, addressing a structural bottleneck in next generation computing.

While many have looked into “corona discharge” for ionic cooling, YPlasma’s DBD technology is said to mark a significant advancement in terms of safety, reliability, and acoustics.

Unlike earlier corona discharge approaches, the dielectric barrier limits electrical discharge and prevents ozone generation. The system operates at approximately 17 decibels, below the threshold of human perception. The absence of exposed needles eliminates tip erosion, a common failure mode in earlier ionic cooling experiments, extending operational lifespan to match consumer device cycles.

According to the website:

Media, investors, and industry partners are invited to witness the technology in action and meet the leadership team during a dedicated live showcase:

• Event: Live Demo of Plasma-Cooled Laptop Prototype

• When: Wednesday, January 7th, 2026, at 4:00 PM

• Where: Stand #60845, Eureka Park (Venetian Expo, Hall G)

CES 2026 will mark the first real world test of whether plasma cooling can move from laboratory promise to commercial standard. Manufacturers, regulators, and silicon vendors will be watching closely to see if fanless thermal control becomes the next structural shift in computing hardware design.

CES (Consumer Electronics Show) is the world’s most influential annual tech trade show held in Las Vegas, showcasing groundbreaking innovations, new products, and consumer technologies.