MediaTek is preparing its next wave of mobile chips. The company is expected to launch the Dimensity 9600 SoC later this year. It is positioned as the upcoming flagship processor. At the same time, MediaTek is also developing the Dimensity 8600 for upper-midrange smartphones. This segment has become a stronghold for the company in recent years.
The Dimensity 8 series has often led AnTuTu benchmark charts. It has consistently powered high-performing upper-midrange phones. In this space, Qualcomm appears to have lost ground to MediaTek. Now attention is shifting to what comes next for the 8 series. The Dimensity 8600 is shaping up as its next major step.
A new leak from China suggests a major upgrade in manufacturing. The chip is said to use a 3nm process. This would be a clear jump from the Dimensity 8500, which is built on a 4nm process. The report also claims the chip will feature a fully redesigned architecture. However, no detailed specifications were shared.
The Dimensity 8 series is known for its all-big-core CPU design. The new model is also expected to continue this approach. It may include upgraded cores for better performance and efficiency. It is still unclear whether a Prime core will be added. That would improve performance but could increase costs. The final design may depend on the pricing strategy.
On the device side, testing has already started. Smartphones from Oppo and vivo are reportedly using early Dimensity 8600 samples.
These phones are expected to launch by the end of the year. Some models may also feature very large batteries, reaching up to 10,000 mAh. The coming months will show how MediaTek positions the Dimensity 8600. The upper-midrange segment is becoming more competitive, and the next chip could shape that battle further.
