Samsung may introduce a major design change with its next flagship chipset, the Exynos 2700. A new report claims the company could replace its current packaging technology with a different approach for the upcoming processor.
The company has used Fan-Out Wafer-Level Packaging (FOWLP) since the launch of the Exynos 2400. The technology helped improve thermal management and kept the chipset cooler during heavy workloads. However, reports suggest the manufacturing process remained expensive and less profitable for Samsung.
Now, Samsung reportedly plans to switch to a new packaging structure called Side-by-Side (SbS) for the Exynos 2700. According to an industry official cited in the report, the new design places the application processor (AP) and DRAM next to each other on the substrate instead of stacking them vertically.
This new layout could offer better heat control and improved internal space management. In addition, Samsung may also add its Heat Pass Block (HPB) technology to the chipset. The feature is expected to improve heat dissipation and deliver better thermal efficiency during demanding tasks.
Samsung is likely to use the Exynos 2700 in the upcoming Galaxy S27 and Galaxy S27+. Both smartphones are expected to debut in early 2027.
